We will work closely with British Institute for Non-Destructive Testing (BINDT) and the Research Centre for Non-Destructive Evaluation (RCNDE). In particular, each meeting will include talks from BINDT members, providing valuable insight on industrial needs, operational constraints, and emerging challenges. Academic researchers will also be encouraged to present latest THz developments, case studies, and demonstrations to stimulate technological adoptions. We will also facilitate discussions with members to ensure that the SIG captures a wide spectrum of perspectives and addresses both scientific and practical deployment challenges. These interactions will help identify shared research priorities, highlight opportunities for joint projects, and promote the transition of THz technologies from laboratory development to robust, validated industrial solutions.
The SIG will cover the full spectrum of THz-enabled industrial NDT and process monitoring, including but not limited to:
Material characterisation
- Defect detection across a wide range of materials
- Measurement properties and variations
- Multilayer structures
- 2D and 3D imaging
THz technologies
- Time-domain, frequency-modulated FMCW, and other broadband techniques
- VNA and electronic techniques
- Narrow-band systems
- Passive detection methods
Validation and standards
- Procedures and criteria for validation
- Standardisation efforts
- Verification and calibration methodologies
The SIG will encourage inclusive participation from early-career researchers, SMEs, underrepresented groups, and stakeholders new to THz technologies. By fostering cross-disciplinary engagement and promoting equitable access to expertise and resources, the group will stimulate innovation, enable knowledge exchange, and support the wider adoption of THz technologies in NDT.
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